PART |
Description |
Maker |
1FGS304-551TG MGS272-636TT FBS225-551GG FBS225-551 |
304 POS FR-4 BGA SOCKET BGA304, IC SOCKET 272 POS 1.27MM BGA SOCKET BGA272, IC SOCKET 225 POS FR-4 BGA SOCKET BGA225, IC SOCKET 521 POS FR-4 BGA SOCKET BGA521, IC SOCKET 303 POS FR-4 BGA SOCKET BGA303, IC SOCKET 540 POS FR-4 BGA SOCKET BGA540, IC SOCKET 456 POS FR-4 BGA SOCKET BGA456, IC SOCKET 475 POS FG4 BGA SOCKET BGA475, IC SOCKET 400 POS 1.27MM BGA SOCKET BGA240, IC SOCKET BGA400, IC SOCKET BGA121, IC SOCKET BGA396, IC SOCKET BGA256, IC SOCKET 169 POS FR-4 BGA SOCKET BGA169, IC SOCKET 432 POS FR-4 BGA SOCKET BGA204, IC SOCKET
|
Advanced Interconnections, Corp. ADVANCED INTERCONNECTIONS CORP
|
IBM25PPC405GP-3BE266C IBM25PPC405GP-3EE200C IBM25P |
MICROPROCESSOR|32-BIT|CMOS|BGA|413PIN|PLASTIC MICROPROCESSOR|32-BIT|CMOS|BGA|456PIN|PLASTIC 微处理器| 32位|的CMOS | BGA封装| 456PIN |塑料
|
Jameco Electronics Mitel Networks, Corp.
|
UPD44325084F5-E37-EQ2-A UPD44325084F5-E50-EQ2-A UP |
4M X 8 QDR SRAM, 0.45 ns, PBGA165 13 X 15 MM, LEAD FREE, PLASTIC, BGA-165 4M X 8 QDR SRAM, 0.45 ns, PBGA165 13 X 15 MM, PLASTIC, BGA-165
|
NEC, Corp.
|
AS4DDR32M72PBG1-6_ET AS4DDR32M72PBG1-6_IT AS4DDR32 |
32M X 72 DDR DRAM, 0.8 ns, PBGA208 16 X 23 MM, 1 MM PITCH, PLASTIC, BGA-208 32Mx72 DDR SDRAM iNTEGRATED Plastic Encapsulated Microcircuit
|
Austin Semiconductor, Inc
|
TSC51C2XXX-12IB TSC51C2XXX-16IB TSC51C2XXX-A12IB T |
IC MAX 7000 CPLD 512 208-PQFP IC MAX IIZ CPLD 570 LE 256-MBGA IC MAX 7000 CPLD 512 256-FBGA 484-pin FineLine BGA RoHS Compliant: Yes 956-pin BGA RoHS Compliant: Yes IC,FPGA,32470-CELL,CMOS,BGA,1020PIN,PLASTIC FPGA Logic IC Logic Type:FPGA; No. of Macrocells:726; Package/Case:1020-BGA; Leaded Process Compatible:No; Number of Circuits:32; IC,FPGA,4800-CELL,CMOS,BGA,484PIN,PLASTIC IC,FPGA,10570-CELL,CMOS,BGA,672PIN,PLASTIC IC,FPGA,14400-CELL,CMOS,BGA,780PIN,PLASTIC No. of Macrocells:192; No. of Pins:68; Operating Temp. Max:85°C; Operating Temp. Min:0°C; Propagation Delay:7.5ns RoHS Compliant: Yes; No. of Macrocells:192; No. of Pins:100; Operating Temp. Max:85°C; Operating Temp. Min:0°C; Propagation Delay:7.5ns RoHS Compliant: Yes; No. of Macrocells:160; No. of Pins:84; Operating Temp. Max:70 C; Operating Temp. Min:0 C; Propagation Delay:10ns RoHS Compliant: Yes; No. of Macrocells:440; No. of Pins:100; Operating Temp. Max:85°C; Operating Temp. Min:0°C; Propagation Delay:9ns RoHS Compliant: Yes; 8-BIT MICROCONTROLLER 8位微控制 IC MAX 7000 CPLD 128 100-PQFP 8位微控制 IC MAX 7000 CPLD 160 84-PLCC 8位微控制
|
TE Connectivity, Ltd. Diodes, Inc. Semtech, Corp.
|
K6F1016U4C |
IC,SRAM,64KX16,CMOS,BGA,48PIN,PLASTIC
|
samsung
|
FGA272-638G FGA303-638G FGAX600-638G FGA304-638G F |
272 POS 1.27MM BGA ADAPTER BGA272, IC SOCKET 303 POS 1.27MM BGA ADAPTER BGA303, IC SOCKET 600 POS 1.27MM BGA EXTRACTION ADAPTER BGA600, IC SOCKET 304 POS 1.27MM BGA ADAPTER BGA304, IC SOCKET 168 POS 1.27MM BGA EXTRACTION ADAPTER BGA168, IC SOCKET 304 POS 1.27MM BGA EXTRACTION ADAPTER 255 POS 1.27MM BGA EXTRACTION ADAPTER 357 POS 1.27MM BGA ADAPTER 560 POS 1.27MM BGA ADAPTER
|
Advanced Interconnections, Corp. ADVANCED INTERCONNECTIONS CORP
|
AS4DDR32M72PBG-8/IT |
32M X 72 DDR DRAM, 0.8 ns, PBGA219 32 X 25 MM, PLASTIC, BGA-219
|
Austin Semiconductor, Inc Micross Components
|
OR3TP127BA352-DB |
PCI BUS CONTROLLER, PBGA352 PLASTIC, BGA-352
|
Lattice Semiconductor, Corp.
|
CYM26KAH24AV33-10BGC CYM26KAH24AV33-12BGC CYM26KAH |
256K X 24 MULTI DEVICE SRAM MODULE, 10 ns, PBGA119 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 256K X 24 MULTI DEVICE SRAM MODULE, 12 ns, PBGA119 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 Memory 内存
|
Cypress Semiconductor, Corp. Electronic Theatre Controls, Inc.
|
LRS1310 |
IC,MIXED MEMORY,FLASH+SRAM,HYBRID,BGA,56PIN,PLASTIC
|
Sharp Corp
|
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